Device image illustrating SuperBrain 1, showing the headband and front lenses.

7Sense / Telehaptic technology

SuperBrain 1

SuperBrain 1 combines haptic feedback with a thermal camera and Time-of-Flight sensors. It supports smartphone connectivity, haptic applications (hApps) and third-party development through an SDK.

€9,000 + VAT

The 7Sense approach

Spatial information,
felt through touch.

Our telehaptic technology conveys information about surrounding objects and movement through our own Haptic Mat™ technology on the forehead. Explore the features and specifications of SuperBrain 1 below.

About the technology
Studio angle of the supplied device showing its fabric headband and lenses.
Form and materials
Haptic Mat™ and its contact-point array inside the device.
Haptic Mat™

The details

Specifications

Explore the features of SuperBrain 1. Contact our team with any product questions.

SuperBrain 1 specifications
SpecificationSuperBrain 1
Device typeWearable device
Battery runtimeUp to 3 hours
PowerBattery powered, with power bank capability
Haptic signalsRepresent raw situational and environmental information
Field of viewTotal 185° horizontal and 120° vertical
Depth and imagingPoint Cloud and RGB with 3D Stereo vision
Time-of-Flight sensorsExtended field of view and readiness for gesture detection
Gesture detectionReadiness for gesture detection via Time-of-Flight sensors
Thermal cameraAnalyzes the temperature of objects
ApplicationshApps (haptic applications)
ConnectivityBluetooth and WiFi connectivity in certain situations
Third-party developmentSoftware Development Kit (SDK) support for custom hApps development

Try SuperBrain

Arrange a
demonstration.

Contact us to discuss a model, ask a product question or arrange a demonstration near you.

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Co-funded by the European Union. Horizon Europe EIC Accelerator grant agreement number 190148354.Co-funded by the European Union and the Republic of Estonia.

Supported by the Estonian Business and Innovation Agency with a grant of €34,562.50 for “7S – 2. generation of haptic device concept development”. Funding acknowledgements